3D Integration in VLSI Circuits

3D Integration in VLSI Circuits

4/5

Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.

5-dimensional (2.

5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monol.

Format
233 pages
First published
2018
Publishers
Taylor & Francis Group

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